PCB Fabrication
HDI PCB
High-density interconnect PCB with blind and buried vias, fine line width down to 3mil/3mil for compact, high-performance electronic designs.
Specifications
- Via Type
- Blind & Buried Vias
- Min. Line Width/Spacing
- 3mil / 3mil
- Min. Hole Size
- 0.15mm
- Min. Inner Layer Thickness
- 0.1mm
- Impedance Tolerance
- +/-10%
- Process
- LDI Exposure, Impedance Control
Product Overview
HDI PCB built with blind and buried vias using laser direct imaging exposure and impedance control. The process supports line width and spacing down to 3mil, minimum hole size of 0.15mm and minimum inner layer thickness of 0.1mm, enabling higher routing density in a smaller board area.
Applications
HDI construction suits compact, high-performance designs where fine-pitch components and high signal counts cannot be routed on a standard multilayer stackup, including medical devices, automotive electronics, advanced consumer electronics and communication equipment.
Ordering Guidance
HDI requires additional process steps, so send your design files early for a stackup and DFM review. Provide layer count, via requirements, line width and spacing targets, impedance requirements and quantity so the manufacturer can confirm feasibility and lead time.