PCB Fabrication
Multilayer PCB
High-layer-count multilayer PCB from 1 to 40 layers, built on FR-4 and high-TG materials with controlled impedance and blind/buried via options for demanding industrial, medical and communication boards.
Specifications
- Layers
- 1-40 layers
- Board Thickness
- 0.4mm - 6.0mm
- Min. Line Width/Spacing
- 3mil / 3mil
- Min. Hole Size
- 0.15mm
- Material
- FR-4, High TG FR-4, Halogen-free FR-4
- Surface Finish
- HASL, ENIG, Immersion Tin, OSP, Hard Gold
- Process
- HDI, Blind & Buried Vias, Back Drill, Impedance Control
- Impedance Tolerance
- +/-10%
Product Overview
Multilayer PCB fabrication from 1 to 40 layers on FR-4, high-TG FR-4 and halogen-free FR-4, with controlled impedance, blind and buried vias, back drilling and thick copper options. Standard production covers 1-18 layers with minimum line width and spacing of 0.1mm, minimum hole diameter of 0.20mm at a 10:1 aspect ratio, maximum copper thickness of 4Oz and impedance tolerance within plus or minus 10 percent.
Applications
Multilayer boards suit products where routing density and signal integrity matter together, including industrial control, communication equipment, medical devices, automotive electronics and power supply designs.
Ordering Guidance
To confirm a multilayer build, send your Gerber file together with layer count, board thickness, material, copper weight, surface finish, impedance requirements and quantity. Multilayer samples are typically quoted at around 7 days with bulk production at 12-15 days, and these are reviewed against your specific stackup before scheduling.