Material:FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg Surface finished:Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger soldermask colour:Green, Yellow, Black, Purple, Blue, White and Red ROHS,ISO9001, UL Certificate Product description: Printed Circuit Board assembly, PCB manufacturer, Printed Circuit Board design, PCB production, PCB assembly, PCB layout, PCB design, Printed Circuit Board terminal block, Printed Circuit Board layout
Production Capacity | |
Feature | Technical specification |
Number of layers | 1-18L |
Max.Panel Size | 635x1120mm |
Max.Copper Thickness | 4Oz |
Min.Line Width | 0.1mm |
Mix.Line Space | 0.1mm |
Min. Hole Diameter | 0.20mm((Aspect Ratio 10:1)) |
Warp & Twist | ≤0.75% |
Impedance Tolerance | +/-10% |
Copper Thickness in Holes | 20um |
Min board thickness(double layer PCB) | 0.3mm |
Min Board Thickness(multilayer PCB) | 0.4mm |
Min. Inner Layer Thickness | 0.1mm |
Min.Hole Position Tolerance | ±0.075mm |
Min.Hole Diameter Tolerance | ±0.075mm |
Min.Outline Tolerance | ±0.10mm |
Pattern Alignment Tolerance | ±/0.075mm |
Surface Finished | Lead-free HASL/Leaded HASL/ENIG/Immersion Silver/Gold Finger/OSP |
Material | FR-4/High TG FR-4/Halogen-free FR-4/Heavy Copper FR-4/Aluminum Substrate |
Lead Time | double layer: samples:5days,bulk production:7-10days Multilayer PCB:samples:7days,bulk production:12-15days |
