Mutilayer PCB
Material:FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg Surface finished:Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger soldermask colour:Green, Yellow, Black, Purple, Blue, White and Red ROHS,ISO9001, UL Certificate Product description: Printed Circuit Board assembly, PCB manufacturer, Printed Circuit Board design, PCB production, PCB assembly, PCB layout, PCB design, Printed Circuit Board terminal block, Printed Circuit Board layout
Process Capability: | ||
SERIAL | ITEM | TECHNICAL DATA |
1 | Layers | 4－18(layers) |
2 | Board material type | FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more |
3 | Max Board Size | 457 x 610 mm |
4 | Min Board Thickness | 4(layers) 0.40mm |
6(layers) 0.80mm | ||
8(layers) 1.00mm | ||
10(layers)1.20mm | ||
5 | Min Line Width | 0.10mm |
6 | Min Line Space | 0.10mm |
7 | Min Hole Size | 0.20mm |
8 | PTH Wall Thickness | 0.020mm |
9 | PTH dia tolerance | ±0.05mm |
10 | NPTH hole dia tolerance | ±0.025mm |
11 | Hole Position Deviation | ±0.05mm |
12 | Outline Tolerance | ±0.1mm |
13 | S/M Pitch | 0.08mm |
14 | Insulation Resistance | 1E+12Ω(Normal) |
15 | Aspect ratio | 10:01 |
16 | Thermal Shock | 3x10Sec@288 ℃ |
17 | Warp and Twist | ≤0.7% |
18 | Electric Strength | >1.3KV/mm |
19 | Peel Strength | 1.4N/mm |
20 | Solder Mask Abrasion | ≥6H |
21 | Flammability | 94V-0 |
22 | Impedance Control | ±5% |
23 | SMT Jointing Min.Space | 0.1mm |
24 | QFP Space | pitch 0.3mm |
25 | Min.Package | 201 |
26 | Min.Size | 50mm x 50mm |
27 | Max.size | 350mm x 550mm |
28 | Placement precision | ±0.01mm |
29 | Placement rang | QFP,SOP,PLCC,BGA |
30 | Placement capability | 805,060,304,020,201 |
31 | Solder mask type | Green, Yellow, Black, Blue, White and Red |
32 | Surface finish | Hot air level（HAL), ENIG, immersion silver, gold plating, immersion tin and gold finger |